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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3228T5S
LOW DISTORTION DOWN-CONVERTER + AGC AMPLIFIER + VIDEO AMPLIFIER
DESCRIPTION
The PC3228T5S is a silicon bipolar monolithic IC designed for use as IF down-converter for digital TV, digital CATV. This IC consists of AGC amplifier, mixer and video amplifier. The package is 32-pin plastic QFN (Quad Flat Non-lead) package suitable for surface mount. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses silicon nitride passivation film. This material can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformly and reliability.
FEATURES
* Total performance : ICC = 85 mA TYP. @ VCC = 5 V : CG = 28 dB TYP. : GCR = 70 dB TYP. : IM3 = 47 dBc MIN./57 dBc TYP. @ Single Ended-OUT = 0.5 Vp-p/tone * VIDEO AMPLIFIER BLOCK : GV = 59 dB TYP. : fIF (BW) = 20 to 100 MHz : IM3 = 45 dBc MIN./55 dBc TYP. @ Output = 110 dBu/tone, Differential-out * High-density surface mounting : 32-pin plastic QFN package (5.0 5.0 0.75 mm) * AGC AMPLIFIER + MIXER + DRIVER BLOCK : fRF (BW) = 20 to 800 MHz
APPLICATION
* Digital CATV * Cable modem receivers
ORDERING INFORMATION
Part Number PC3228T5S-E2 Order Number PC3228T5S-E2-A Package 32-pin plastic QFN (Pb-Free) Marking C3228 Supplying Form Embossed tape 12 mm wide Pin 8,9 face the perforation side of the tape Qty 2.5 kpcs/reel Dry pack specification
Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC3228T5S
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Document No. PU10623EJ01V0DS (1st edition) Date Published June 2006 NS CP(K)
PC3228T5S
INTERNAL BLOCK DIAGRAM AND PIN CONFIGURATION
(Top View)
24 GND-AGC 17 GND-MIX
16 GND-MIX RF_AGC AMP GND-Driv 26 Driv-OUT1 27 LO AMP Driv-OUT2 28 Driver AMP GND-Driv 29 GND 30 IF_IN AMP IF-IN1 31 Driver AMP IF-IN2 32 9 GND-IF2
Note
21 VCC-AGC
19 VCC-MIX
20 VCC-Driv
GND-AGC
Note
25
18 VCC-LO
23 RF-IN2
22 RF-IN1
Note
15 LO-IN2 14 LO-IN1 13 GND-LO AGC Control IF_IN AMP2 10 IF-OUT1 12 VCC-IF2 11 IF-OUT2
1
2
3
4
5
6
7 NC
GND-REG
Note 1, 9, 17, 25-pin: Connected to the lead frame.
2
GND-IF1
Data Sheet PU10623EJ01V0DS
GND-REG
GND-IF1
GND-IF2
Note
VCC-IF1
VAGC
8
PC3228T5S
ABSOLUTE MAXIMUM RATINGS
P a r a me t e r Supply Volt age Power Dissipation Operating Ambient Temperature Storage Temperature S y mb o l VCC PD TA Tstg TA = +25 C TA = +80 C Note Note C o nd it i o n s R a t in g s 6.0 800 20 to +80 55 to +150 Un i t V mW C C
Note Mounted on double-sided copper-clad 50
50
1.6 mm epoxy glass PWB
RECOMMENDED OPERATING RANGE (TA = +25 C, unless otherwise specified)
Parameter Supply Vo lt age Operating Ambient Temperature Gain Control Voltage Range RF Operating Frequency Range IF Operating Frequency Range Symbol VCC TA VAGC fRF (BW) fIF (BW) VCC = 4.5 to 5.5 V Conditions MIN. 4 .5 20 0 20 20 TYP. 5.0 +25 MAX. 5.5 +80 3.3 800 100 Unit V C V MHz MHz
Data Sheet PU10623EJ01V0DS
3
PC3228T5S
ELECTRICAL CHARACTERISTICS (TA = +25 C, VCC = 5 V, unless otherwise specified)
Parameter DC Characteristics Circuit Current AGC Voltage High Level AGC Voltage Low Level RF Characteristics (RF AGC Amplifier Block + Mixer Block + Driver Amplifier: fRF = 80 MHz, fLO = 130 MHz, PLO = 10 dBm, ZS = 50 , ZL = 400 /16 pF) RF Input Frequency Range RF Gain Control Range Mixer Conversion Gain fRF GCR1 CG fC = 3 dB VAGC = 0 to 2.5 V VAGC = 2.5 V Differential-IN: Vin = +18 dBmV Note 1 3rd Order Intermodulaion Distortion IM31 f1 = 44 MHz, f2 = 45 MHz, Vin = +30 dBmV/tone, Single Ended-OUT = 0.5 Vp-p/tone Note 1 Noise Figure NF1 VAGC = 2.5 V, f = 50 MHz, Differential-Output IF Characteristics (IF Amplifier Block + Driver Amplifier: fIF = 50 MHz, ZS = 50 , ZL = 2 100 ) IF Input Frequency Range IF Amplifier Gain fIF GV fC = 3 dB Vin = 7 dBmV, Differential-IN/OUT 3rd Order Intermodulaion Distortion IM32 f1 = 49.5 MHz, f2 = 50.5 MHz, Vout = 110 dBu/tone, Differential-IN/OUT I F O u t p u t V o l ta g e Noise Figure Vout NF2 Single Ended-Output VAGC = 0 V, f = 50 MHz, Single Ended-Output Note 2 Note 5 Note 5 1.0 3.0 Vp-p dB Note 5 45 55 dBc Note 5 20 56 59 100 62 MHz dB Note 2 8.3 dB 47 57 dBc Note 1 Note 1 20 62 25 70 28 31 800 MHz dB dB ICC VAGC (H) VAGC (L) No input signal @ Maximum gain @ Minimum gain Note 1 Note 1 Note 1 65 2.5 0 85 110 3.5 mA V V Symbol Test Conditions MIN. TYP. MAX. Unit
Total Block (RF AGC Amplifier + Mixer + Driver Amplifier + SAW Filter + IF Ampliter + Driver Amplifier), SAW Filter : EPCOS X6889M (fIF = 49 MHz, PLO = 10 dBm, fRF = 70 to 130 MHz, ZS = 50 LO-RF Leakage LORF VAGC = 2.5 V, 22-pin 75 fLO = 110 to 180 MHz LO-IF Leakage LOIF VAGC = 2.5 V, Vout = 0.7 Vp-p Single Ended-Output fRF = 130 MHz, fLO = 179 MHz Note 4 Termination Note 3 40 25 dBc , ZL = 1 050 ) 54 44 dBmV
Notes 1. By measurement circuit 1 2. By measurement circuit 2 3. By measurement circuit 3 4. By measurement circuit 4 5. By measurement circuit 5
4
Data Sheet PU10623EJ01V0DS
PC3228T5S
MEASUREMENT CIRCUIT 1
S.G Vin 51 1 nF 1 nF 1 nF 1 nF Spectrum Analyzer 50
24 22 21 19 23 20 18 17
1 nF
1 nF VCC
PLO 16 Note 15 1 nF 51 14
25 VOUT = Vout1 - Vout2 26 Vout1 Differential Probe (10:1) 1 M //7 pF 16 pF Vout2 1 nF 27 400 28 1 nF 29 30 Note 31 51 0.1 F 32
1 2 3 4 5 6 7 8
RF_AGC AMP
S.G 50
LO AMP 13 Driver AMP AGC Control IF_IN AMP IF_IN AMP2 10 Driver AMP 9 12 11
1 nF 0.1 F
0.1 F 0.1 F
1 000 1 000
50 50
0.1 F
100 pF 0.1 F 1k
VAGC
Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type)
Data Sheet PU10623EJ01V0DS
5
PC3228T5S
MEASUREMENT CIRCUIT 2
Noise Figure
Noise Source
50
24 23 22 21 19 18 20 17
Hybrid Coupler MA/Com H183-4 30-3 000 MHz
50
1
3
5
6
7
2
4
100 pF 0.1 F 1k
VAGC
Noise Source
Noise Figure Meter 50
Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type)
6
Data Sheet PU10623EJ01V0DS
8
Noise Figure Meter
1 nF 1 nF 1 nF 1 nF 1 nF 1 nF VCC
PLO 16 Note 15 1 nF 51 14
25 RF_AGC AMP 26 51 1 nF 27 LO AMP 28 51 1 nF 29 30 Note 31 0.1 F 32 0.1 F Driver AMP IF_IN AMP IF_IN AMP2 Driver AMP AGC Control
S.G 50
1 nF 13 0.1 F 12 11 0.1 F 10 0.1 F 9 1 000 50 1 000
PC3228T5S
MEASUREMENT CIRCUIT 3
Lo-RF Leakage
Spectrum Analyzer 50
VOUT
24
1 nF 1 nF 1 nF 1 nF 1 nF 1 nF VCC
24 23 22 21 20 19 18 17
PLO 16 Note 15 1 nF 51 14
25 RF_AGC AMP 26 1 nF 27 16 pF 400 28 1 nF 29 30 Note 31 51 0.1 F 32
1 2 3 4 5 6 7 8
S.G 50
LO AMP 13 Driver AMP AGC Control IF_IN AMP IF_IN AMP2 10 Driver AMP 9 12 11
1 nF 0.1 F
0.1 F 0.1 F
1 000 1 000
0.1 F
100 pF 0.1 F 1k
VAGC
Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type)
Data Sheet PU10623EJ01V0DS
7
PC3228T5S
MEASUREMENT CIRCUIT 4 (fRF = 70 to 130 MHz (fIF = 49.1 MHz (Single Ended))
LO-IF Leakage
S.G Vin 51 1 nF 1 nF 1 nF 1 nF 1 nF 1 nF VCC
24 23 22 20 21 19 18 17
0.6 MHz), fLO = 119 to 179 MHz, PLO = 10 dBm, Vout = 0.7 Vp-p
PLO 16 Note 15 1 nF 51 14
25 RF_AGC AMP 26 1 nF 27 LO AMP 28 1 nF SAW Filter EPCOS X6889M 29 30 IF_IN AMP 31 0.1 F 32
1 4 6 2 3 5 7 8
S.G 50
1 nF 13 0.1 F
Driver AMP AGC Control IF_IN AMP2 10 Driver AMP 9 0.1 F 12
Vout1 11 0.1 F 1 000 1 000
Spectrum Analyzer 50
50
0.1 F
Vout2
100 pF 0.1 F 1k
49 M
fLO
VAGC
Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type)
8
Data Sheet PU10623EJ01V0DS
PC3228T5S
MEASUREMENT CIRCUIT 5
IF Block
51 1 nF 1 nF 1 nF 1 nF 1 nF 1 nF VCC
24
23
22
21
20
19
18
25 RF_AGC AMP 26 1 nF 27 16 pF 400 28 1 nF 29 Vin S.G 51 Note 31 0.1 F 32 0.1 F 50 Vin2 VIN = Vin1 - Vin2 Differential-IN 100 pF 0.1 F 1k Driver AMP Vin1 30 IF_IN AMP IF_IN AMP2 Driver AMP AGC Control LO AMP
17
16 Note 15 1 nF 14 1 nF 13 0.1 F 12 Vout2 11 0.1 F 10 0.1 F 9 1 000 50 1 000 Spectrum Analyzer 50 51
2
4
6
1
3
5
7
8
Vout1 VOUT = Vout1 - Vout2 Differential-OUT
VAGC
Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type)
Data Sheet PU10623EJ01V0DS
9
PC3228T5S
ILLUSTRATION OF THE EVALUATION BOARD
VCC
RF LO
R1 C1 VOUT1 IF R2 C1 R2 C2 VOUT2 IF R1 C2 Note C2 C3 R3 C2 R3 OUT1 C1 C4C5 C1 C1 C1 C1 C1 C2 C2 R3 C1 C1 R1 Note OUT2
VCC VAGC
Note Balun Transformer : TOKO 617DB-1674 B4F (Double balanced type) Remarks 1. Back side: GND pattern 2. Solder plated on pattern 3. : Through hole
USING THE NEC EVALUATION BOARD
Symbol C1 C2 C3 C4 C5 R1 R2 R3 Values 1 nF 0.1 F 100 pF 10 pF 6 pF 51 200 1 000 Maker Murata Murata Murata Murata Murata Susumu Susumu Susumu Part Number GRM39CH GRM39B GRM39CH GRM36B GRM36B RR0816 510SSM RR0816 201SSM RR0816 102SSM Size 1608 1608 1608 1005 1005 1608 1608 1608
10
Data Sheet PU10623EJ01V0DS
PC3228T5S
PACKAGE DIMENSIONS 32-PIN PLASTIC QFN (UNIT: mm)
(Top View)
5.00.1 0.160.05
(Side View)
(Bottom View)
(1.75)
5.00.1
(1.75)
C3228
Laser Marked Index
(Side View)
(0.21)
(0.75) 0.85 MAX.
0.760.1
12
(0.20)
(0.865)
0.4
21
(1.1)
Exposed Die Pad To be connected
Data Sheet PU10623EJ01V0DS
11
PC3228T5S
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground terminals must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Infrared Reflow S o l d e r i n g Con di tion s Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220 C or higher Preheating time at 120 to 180 C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260 C or below : 10 seconds or less : 60 seconds or less : 120 30 seconds : 3 times : 0.2%(Wt.) or below : 260 C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350 C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Con dit io n Sy mb ol IR260
For soldering
Preheating temperature (package surface temperature) : 120 C or below
Caution Do not use different soldering methods together (except for partial heating).
12
Data Sheet PU10623EJ01V0DS
4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information.
Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*)
If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative.
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